1+N+1

Blind vias

Yes

Yes

Yes

4 layers+

2+N+2

Blind/Buried
staggered vias

Yes

Yes

Yes

6 layers+

2+N+2

Blind/Buried
stacked vias

Yes

Yes

Yes

6 layers+

3+N+3

Blind/Buried
staggered vias

/

Yes

Yes

8 layers+

3+N+3

Blind/Buried
stacked vias

/

/

Yes

8 layers+

Quality Grade

Standard IPC 2

Number of Layers

4 - 24layers

Order Quantity

1pc - 10000+pcs

Build Time

2days - 5weeks

Material

FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination

Board Size

Min 6*6mm | Max 457*610mm

Board Thickness

0.4mm - 3.0mm

Copper Weight (Finished)

0.5oz - 2.0oz

Min Tracing/Spacing

2.5mil/2.5mil

Solder Mask Sides

As per the file

Solder Mask Color

Green, White, Blue, Black, Red, Yellow

Silkscreen Sides

As per the file

Silkscreen Color

White, Black, Yellow

Surface Finish

HASL - Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG - Electroless Nickle/Immersion Gold - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP - Organic Solderability Preservatives - RoHS

Min Annular Ring

4mil, 3mil - laser drill

Min Drilling Hole Diameter

6mil, 4mil - laser drill

Max Exponents of Blind/Buried Vias

stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected

Other Techniques

Flex-rigid combination
Via In Pad
Buried Capacitor (only for Prototype PCB total area ≤1m²)